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Evaluation of grindinginduced subsurface damage in ...

Mar 01, 2016· Read "Evaluation of grindinginduced subsurface damage in optical glass BK7, Journal of Materials Processing Technology" on DeepDyve, the largest online rental service for scholarly research with thousands of academic publications available at your fingertips.

SUBSURFACE DAMAGE IN GRINDING TITANIUM ALUMINIDE ...

The grindinginduced damage beneath the ground surfaces was found to consist of plastic deformation and microcracks. The severity and depth of the subsurface damage zone increased with an increase in the abrasive grit size and the depth of cut. Microcracks were observed when grinding was performed with the silicon carbide wheel at a depth of ...

Grinding induced subsurface cracks in silicon wafers ...

Read "Grinding induced subsurface cracks in silicon wafers, International Journal of Machine Tools and Manufacture" on DeepDyve, the largest online rental service for scholarly research with thousands of academic publications available at your fingertips.

On Surface Grind Hardening Induced Residual Stresses ...

On Surface Grind Hardening Induced Residual Stresses ... fluid significance [4], the grinding wheel specifications effect [5] and recently the grinding forces [6]. However, grindhardening induced residual stresses simulation has not been presented up to now. In a number of experimental studies it has been shown that grindhardening results in ...

The Book of Grinding

Indepth, practical, comprehensive grinding education for hardcore grinders working in production grinding. Overview: The Book of Grinding is the most indepth, comprehensive, practical resource in existence for engineers, machine operators and salespeople working in production grinding. It has been created in The Grinding Doc’s popular, graphicsfocused style of describing complex grinding ...

Grindinginduced metallurgical alterations in the binder ...

The resulting residual stress profile is the sum of multiple subsurface changes, such as phase transformation, severe plastic deformation and grain refinement, where it is discerned that the depth profile of the transformed hcpCo fraction coincides with the grindinginduced residual stress profile.

JOURNAL OF MATERIALS SCIENCE37 Mechanical property ...

Figure 2 The structure under optical microscopy. (a) the ordinary martensite; (b) the grindinginduced layer (depth of cut=70 µm, table velocity= m/min). Figure 3 Effect of infeed velocity on microhardness of the grindinginduced layer (Depth of cut 70 …

Grinding Induced Changes in Residual Stresses of ...

Grinding Induced Changes in Residual Stresses of Carburized Gears R. LeMaster, B. Boggs, J. Bunn, C. Hubbard and T. Watkins ... depth is similar for all radii greater than the form radius. The material removed at the pitch circle by grinding ranged from Key 1 Dedendum

Grinding induced subsurface cracks in silicon wafers

In order to assess the depth and nature of grinding induced subsurface cracks in silicon wafers, it is desirable to categorize all the possible crack configurations. This knowledge may help to develop models that can explain the formation of different subsurface cracks. However, to our

Machining Residual Stresses

stress depth profile measurement Machining is the general term for turning, milling, drilling, planing and grinding. The common point of these applications is the cutting process that heats the surface of the material due to the friction and forms chips. The figure on the right shows the process steps in

Subsurface Damage (SSD) Assessment in Ground Silicon ...

conditions, but independent of the SSD depth.) Fig. 3 Profilometer trace of a MRF single finishing spot on the surface of ground fused silica ground with alumina abrasives. When the depth of the spot (here about 30 µm) extends below the grindinginduced SSD, surface roughness is minimized. The depth of SSD is about 15 µm. The

EFFECT OF GRINDING ON STRENGTH OF TETRAGONAL …

Apr 27, 2007· The YTZP showed a slight decrease in strength when the depth of cut was increased. However, for ZTA, the strength first decreased, then increased with increasing depth of cut. The grindinginduced subsurface damage, observed by a bondedinterface sectioning technique, consisted of cracks for ZTA, but no subsurface cracks could be found for YTZP.

Bruxism (teeth grinding) Symptoms and causes Mayo Clinic

Aug 10, 2017· If you notice that your child is grinding his or her teeth — or has other signs or symptoms of bruxism — be sure to mention it at your child's next dental appointment. Request an Appointment at Mayo Clinic. Causes. Doctors don't completely understand what causes bruxism, but it may be due to a combination of physical, psychological and ...

Grinding Induced Damage in Ceramics ResearchGate

Zhang and Howes [6] found the depth of grindinginduced damages is related to the properties of ceramic materials, especially the brittleness [7]. The results of Chen et al. [8,9], Zhao et al. [10 ...

Prediction of subsurface damage depth of ground brittle ...

title = "Prediction of subsurface damage depth of ground brittle materials by surface profiling", abstract = "In the manufacturing of infrared optics, grinding is usually used as a premachining process for generating aspherical lens figures on brittle materials such as germanium and silicon before diamond turning or polishing.

Fabrication of CVD diamond micromilling tool by hybrid ...

Aug 12, 2019· In this work, the depth of cut in the grinding process is 1 μm. As a result, the CVD diamond is removed in a brittle manner, mostly by microcleavage and embrittlement cracking. Therefore, the grinding force rises suddenly when grinding the protruding portion, causing notches on …

Prediction of subsurface damage depth of ground brittle ...

depth of subsurface cracks to determine the tool pass numbers. However, to date, there has not been practical, rapid and nondestructive method for measuring the grindinginduced crack depth accurately in the micrometer level. In this paper, we attempt to predict the depth of the grindinginduced microcracks using the surface roughness information.

MACHINING/FINISHING: Diamond Wheel Grinding 101

Jun 01, 2006· The grinding process often generates such stress, and the need to control it is far greater in advanced ceramics than in tungsten carbide/cobalt grades. By selecting a wheel containing smaller but sharper abrasive grains, increasing wheel speeds, decreasing the depth of cut and reducing traverse rates, induced stress can be minimized.

The Book of Grinding

Indepth, practical, comprehensive grinding education for hardcore grinders working in production grinding. Overview: The Book of Grinding is the most indepth, comprehensive, practical resource in existence for engineers, machine operators and salespeople working in production grinding. It has been created in The Grinding Doc’s popular, graphicsfocused style of describing complex grinding ...

Surface Hardening: Hard Turning or Grinding? | Gear ...

The basic mechanism for the more hardened ground surface/subsurface is most likely due to the size effect induced by severe strain gradient in grinding. The smaller down feed in grinding induces a severe strain gradient in near surface, while the relatively larger depth of cut in turning may substantially reduce the size effect. Conclusions

Grinding and Polishing ASM International

Grinding and Polishing GRINDING removes saw marks and levels and cleans the specimen surface. Polishing removes the artifacts of grinding but very little stock. Grinding uses fixed abrasives—the abrasive particles are bonded to the paper or platen—for …

Cup wheel grindinginduced subsurface damage in optical ...

Cup wheel grindinginduced surface and subsurface damage in optical glass BK7 was investigated. • A theoretical model of grindinginduced SSD depth considering the ductileregime effect was applied. • A coupled FEM and SPH 3D model was provided to simulate the grindinginduced …

Residual Stress in Stainless Steels after Surface Grinding ...

Figure 1 Indepth residual stress profiles of (a) 304L ground specimens, (b) 4509 ground specimens, and (c) 2304 ground specimens Residual stress in grinding is caused by the combination of thermal and mechanical effects. During grinding, heat is generated in the surface layer of the workpiece material, thus a temperature

Grinding induced damage in ceramics, Journal of Materials ...

Jan 10, 2003· Damage depth is found to be related to the properties of ceramic materials, especially their brittleness. For a given grinding condition, damage penetrates deeper in less brittle materials than in more brittle materials. In addition, two types of grindinginduced …

Analytical prediction for depth of subsurface damage in ...

Subsurface damage (SSD) induced by silicon wafer grinding process is an unavoidable problem in semiconductor manufacturing. Although experimental attempts have been made on investigation of the influential factors on the SSD depth, however, few theoretical studies have been conducted to obtain SSD depth through grinding parameters.

Depth Profiling of PolishingInduced Contamination on ...

Laserinduced damage on optical surfaces is often associated with absorbing contaminants introduced by the polishing process. This is particularly the case for W optics. In the present study, secondmy ion mass spectroscopy (SIMS) was used to measure depth profiles of finishingprocess contamination on fused silica surfaces.